发明名称 WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board having a structure which can improve suitably electric insulation between terminals for connection. SOLUTION: A plurality of terminals 2 for connection are installed which are stretched from a surface protective film of the wiring board and exposed. At least one trench 3 is formed in an insulating base material 1 between adjacent terminals 2. In a case of a plurality of terminals 4 for connection having a structure wherein a part of a surface protective film 5 of the wiring board is opened, at least one trench 7 is formed in the protective film 5 between aperture parts 6. By forming such a trench, a creeping distance between terminals is ensured and the electric insulation between the terminals is suitably improved. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003283082(A) 申请公布日期 2003.10.03
申请号 JP20020078932 申请日期 2002.03.20
申请人 NIPPON MEKTRON LTD 发明人 TAKANO SHOJI
分类号 H05K1/11;H05K1/02;(IPC1-7):H05K1/11 主分类号 H05K1/11
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