| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module case having a superior filling property of a filling material in manufacturing a semiconductor module case with a radiator by a die casting method. SOLUTION: The semiconductor module case 11 has a mounting base 11a. The mounting base 11a has an upper surface and a lower surface, and the upper surface is named a circuit board mounting surface 11b. A circuit board 13 for mounting semiconductor elements 12 thereon is mounted on the circuit board mounting surface 11b. Under specific circuit boards, the thickness of the mounting base is partly different to form a step. On the circuit board mounting surface 11b, a plurality of ribs 11c are arranged so as to surround each circuit board 13, and on the lower surface 11d opposite side to the circuit board mounting surface 11b, a plurality of heat-radiating fins 11e are arranged in a standing condition. COPYRIGHT: (C)2004,JPO
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