发明名称 METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a field effect transistor whose high-frequency characteristics are superior. SOLUTION: This FET 1 is provided with a substrate 2, a buffer layer 3, a first doped layer 4, an undoped layer 5, a second doped layer 6, an undoped layer 7, a cap layer 8, and a surface layer 9. Also, the FET 1 is provided with a source region 11 and a drain region 13 formed in the layers 3 to 8. Furthermore, the FET 11 is provided with intermediate regions 12 and 14 whose impurity concentrations are lower than those of the source region 11 and the drain region 13. A source electrode 31 is formed on the source region 11, and a drain electrode 32 is formed on the drain region 13. Also, an oxide film 21 is formed in a part excluding the source electrode 31 and the drain electrode 32 on the surface layer 9. The oxide film 21 is formed by oxidizing a semiconductor film to be the surface layer 9 from its surface. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003282597(A) 申请公布日期 2003.10.03
申请号 JP20020081373 申请日期 2002.03.22
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KAGIYAMA TOMOHIRO;SAITO YOSHIHIRO
分类号 H01L21/28;H01L21/338;H01L29/417;H01L29/812;(IPC1-7):H01L21/338 主分类号 H01L21/28
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