| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus in which the uniformity of substrate temperature is improved. SOLUTION: In a heat treatment apparatus for performing heat treatment on a substrate 9, a lamp group for irradiating light to the substrate 9 and an annular shaped auxiliary ring 31 for supporting the substrate 9 are arranged. The auxiliary ring 31 has an annular support portion 311 projected inwardly from an inner circumferential surface 310, and the portion 311 supports the outer edge 91 of the substrate 9 while contacting with the bottom of the substrate. Assuming that the width of the substrate 9 overlapped with the portion 311 is a support width W, the thickness of the portion 311 is a support portion thickness T, and the thickness of the substrate is a substrate thickness Tw, the width W and the thickness T are determined such that ((T×W)≤(Tw×2)) is satisfied. This improves the uniformity of the temperature of a substrate to be heated. COPYRIGHT: (C)2004,JPO
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