发明名称 SUBSTRATE TREATMENT EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide substrate treatment equipment wherein a substrate is sucked, held and rotated by a spin chuck, and treatment by a treatment solution can be performed while the corrosion of the equipment which is caused by the treatment solution is prevented. SOLUTION: An ejector 30 is included in the spin chuck 1, and pressurized air from a pressurized air supply path 15a in a rotating shaft 15 is supplied to the ejector 30. By an ejector effect generated in the ejector 30, negative pressure is generated in a suction path 33 which is communicated with a suction port 14 opened to a suction and holding surface 11. As a result, a substrate W is sucked and held. The pressurized air is discharged in a collection cup 40 from an exhaust vent 16 via a discharge path 32, so that the pressurized air and the treatment solution or the like which is discharged together with the pressurized air are not brought into contact with the substrate W. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003282515(A) 申请公布日期 2003.10.03
申请号 JP20020088029 申请日期 2002.03.27
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 ASA SEKIBUN;HIRAI NOBUYUKI
分类号 H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址