| 摘要 |
PROBLEM TO BE SOLVED: To provide substrate treatment equipment and a substrate treatment method wherein a method in which treatment is preformed by rotating an upper surface member together with a wafer and a method in which a treatment solution supply nozzle is moved to the treatment surface of a wafer and a treatment solution is supplied is performed. SOLUTION: In the substrate treatment equipment 12 wherein the treatment solution is supplied to a substrate W and treatment is performed, a spin chuck 60 for holding the substrate W, and the upper surface member 90 which approaches the substrate W and covers the upper surface of the substrate are installed. The upper surface member 90 is made detachable to the spin chuck 60. As a result, the upper surface member 90 is engaged with the spin chuck 60, and they are rotated as a unit. COPYRIGHT: (C)2004,JPO
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