| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor manufacturing equipment having a vacuum vessel which enables manufacturing of low-cost and high-quality semiconductor film by salving the problem of production in a conventional technology of a natural oxide film due to the absorption of oxygen and water on the surface of a wafer or the like. SOLUTION: In the semiconductor manufacturing equipment having the vacuum vessel (load-lock chamber), the wall of the vacuum vessel is formed of a honeycomb structure 15, and flow holes (circulation holes) 20 are formed in rib faces 17 which are strengthening members of the honeycomb structure 15, and a heat exchange medium is caused to flow through the flow holes 20. The vacuum vessel using the honeycomb structure 15 which is light in weight and has large withstanding pressure strength evacuates the atmospheric air through an exhaust port by means of a vacuum pump or the like while at the same time introducing an inert gas, facilitating the formation of an atmosphere having an extremely low concentration for the air and water. Consequently, a high-quality semiconductor can be manufactured at a low cost without unnecessarily oxidizing the wafer or the like. COPYRIGHT: (C)2004,JPO
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