COPPER INGOT FOR MANUFACTURING ROLLED COPPER FOIL AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a copper ingot for manufacturing rolled copper foil as thin as≤20μm in thickness used for electronic parts, such as flexible printed circuit boards (FPCs), tape carriers (TABs) and electrodes of lithium batteries, and a method for manufacturing the same. SOLUTION: The copper ingot which contains 200 to 300 ppm oxygen and≤0.2 ppm hydrogen and consisting of the balance copper and inevitable impurities and is regulated in the inclusions included in the copper ingot for manufacturing the rolled copper foil to≤30 mg/kg and the method for manufacturing the same. COPYRIGHT: (C)2004,JPO