| 摘要 |
<p>PURPOSE:To provide the title manufacturing method of electronic component mounting multilayered substrate capable of thinning the whole thickness thereof while causing no damage to the electronic component mounting part at all. CONSTITUTION:The title multilayered substrate is provided with an electronic component mounting hole 70 provided in a multilayered board 7, an inner layer circuit 51 provided inside the multilayered board 7 and an outer layer circuit 52 provided outside the same 7. Firstly, the inner layer circuit 51 and the electronic component mounting aperture parts 710-730 are formed in plural insulating substrates 71-73. Next, the plural insulating substrates 71-73 are laminated and fixed so as to form the multilared board 7 having the electronic component mounting hole 70. Next, the aperture part 710 on the lower part of multilayered board 7 and the same 730 on the upper part of the outermost layer are respectively blocked up with blocking members 11 and 12. Next, an outer layer circuit 52 is formed on the surface of the multilayered board 7. Finally, the blocking members 11, 12 are removed from the multilayered board 7.</p> |
