EPOXY RESIN MOLDING MATERIAL FOR ENCAPSULATION AND ELECTRONIC COMPONENTS AND DEVICES

摘要

An epoxy resin molding material for encapsulation comprising (A) an epoxy resin, (B) a curing agent, and (C) a borate flame retardant as the essential components, wherein the borate flame retardant (C) is (C1) an anhydrous borate salt, (C2) zinc borate, or (C3) anhydrous zinc borate; and electronic components or devices comprising elements encapsulated with the material. The invention provides a non-halogen and non-antimony epoxy resin material for encapsulation which is improved in flame retardance without impairing the reliability of molding properties, fluidity, moisture resistance and so on; and electronic components or devices comprising elements encapsulated with the material.