| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition and a photosensitive structure for flexographic printing having high adhesive power. <P>SOLUTION: The photosensitive resin composition is a photosensitive resin (A) comprising a thermoplastic elastomer (a) comprising one or more monovinyl substituted aromatic hydrocarbons and conjugated diene, one or more ethylenically unsaturated compounds (b) and one or more photopolymerization initiators (c), wherein the ethylenically unsaturated compounds (b) are a mixture of (i) a polyester (meth) acrylate having two or more unsaturated bonds and (ii) a (meth) acrylate having one or more aromatic rings and/or one or more hydroxyl groups per molecule in a (i) to (ii) weight ratio of 1:(0.01-1.5). <P>COPYRIGHT: (C)2004,JPO |
