发明名称 RESIN COMPOSITION FOR MOLDING MAKING CONTACT WITH WATER
摘要 PROBLEM TO BE SOLVED: To obtain a resin composition for a molding making contact with water, excellent in mechanical characteristics such as tensile strength, bending elastic modulus and further excellent in heat-aging property and hydrolysis resistance, and to provide the molding. SOLUTION: This resin composition is characterized by containing (A) 100 pts.wt. polyamide resin, (B) 15-150 pts.wt. glass fiber, (C) 0.05-1.0 pts.wt. phenolic thermal stabilizer and (D) 10-5,000 ppm copper compound calculated as copper element based on the component (A), and being used for the molding making contact with water, and the molding is also provided. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003277605(A) 申请公布日期 2003.10.02
申请号 JP20020088938 申请日期 2002.03.27
申请人 ASAHI KASEI CORP 发明人 OYAMADA HIROSHI
分类号 C08J5/00;C08K3/10;C08K5/13;C08K7/14;C08L77/00;(IPC1-7):C08L77/00 主分类号 C08J5/00
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