| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus which selectively performs the plating to a desired place of a conductive work to be plated, and performs no plating on a part unnecessary for the plating. SOLUTION: A metal film is deposited only on the work to be plated immediately below an anode electrode by using a plating apparatus comprising a plating tank to store the plating solution, a holder to holder the work in the plating solution, a needle-like electrode which is disposed in the vicinity of the work in the plating solution, and scanned to an arbitrary position in the longitudinal direction or in the right-to-left direction, and a power source to arbitrarily supply the negative electric potential to the work and the positive electric potential to the electrode while collating the position information of the electrode. COPYRIGHT: (C)2004,JPO
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