| 摘要 |
<p>Machining of crystalline lithium niobate substrate (46) is carried out utilizing a laser (36) having a beam (37) with a wavelength near the absorption edge of lithium niobate substrate (46). The laser beam (37) is provided in pulses of short duration and at a repetition rate selected to ablate the surface of the lithium niobate substrate (46) without damaging the bulk material. Translation of the laser beam (37) and the substrate (46) with respect to each other can be carried out to define a trench of a desired geometry in the lithium niobate.</p> |
