发明名称 PLATTE ZUM BESTÜCKEN MIT BAUTEILEN, VERFAHREN ZUR HERSTELLUNG DER PLATTE UND VERFAHREN ZUR HERSTELLUNG DES MODULS
摘要 Characterized in that a mask film (3) having desired openings (2) are coated onto a metal wiring plate (1). According to this, an insulating base body and a resist layer making a thick base as in a conventional substrate can be omitted. In addition, by bending a terminal part (T) of the metal wiring plate (1), a connecting terminal replaceable with a connecter terminal to another substrate can be also machined integrally and the connecter terminal can be made unnecessary, so that an inexpensive parts-packaging substrate can be provided. <IMAGE>
申请公布号 DE69724372(D1) 申请公布日期 2003.10.02
申请号 DE1997624372 申请日期 1997.04.07
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KUMAGAI, KOICHI;WADA, YOSHINORI;EDAHIRO, TERUKI
分类号 H05K1/00;H05K3/20;H05K3/28;H05K3/34;(IPC1-7):H05K1/02;H05K3/04 主分类号 H05K1/00
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