ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION AND CONNECTED CIRCUIT STRUCTURE PRODUCED BY USING THE SAME

摘要

PROBLEM TO BE SOLVED: To obtain an adhesive composition for circuit connection use exhibiting excellent adhesive force to a composite substrate made of different inorganic materials, and provide a connected circuit structure produced by using the adhesive composition. SOLUTION: The adhesive composition for the circuit connection use contains (a) a radically polymerizable compound, (b) a curing agent generating radicals by light-irradiation or heating, (c) a silane coupling agent expressed by formula (1) (X is an N-containing organic group; R1, R2and R3are each an alkyl; and (n), (m) and (l) are each an integer of 1-3) and (d) a compound containing a group bondable to an inorganic material through an ionic bond. COPYRIGHT: (C)2004,JPO