发明名称 |
Heat treatment apparatus and method for processing substrates |
摘要 |
A heat treatment apparatus includes a vertically disposed process tube defining a reaction chamber therein; a main heater for heating the reaction chamber, the main heater being disposed outside of the process tube; a boat for holding a plurality of wafers, the boat being loaded into and unloaded from the reaction chamber; and a boat rotating device for rotating the boat. The boat rotating device is provided with a rotatable hollow shaft assembly and a fixed shaft coaxially disposed inside the rotatable hollow shaft assembly. A sub-heater is attached to an upper end of the fixed shaft, and the boat and an insulating portion are disposed on the rotatable hollow shaft assembly.
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申请公布号 |
US2003183614(A1) |
申请公布日期 |
2003.10.02 |
申请号 |
US20030395179 |
申请日期 |
2003.03.25 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
YAMAGUCHI TAKATOMO;MORIMITSU KAZUHIRO;MATSUNAGA TATSUHISA |
分类号 |
H01L21/22;C30B31/10;H01L21/00;H01L21/324;H01L21/673;(IPC1-7):F27D11/00;F27B5/14 |
主分类号 |
H01L21/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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