ELECTROPOLISHING APPARATUS, ELECTROPOLISHING METHOD, AND METHOD FOR MANAUFACTURING SEMICONDUCTOR DEVICE

摘要

The formation of a groove wiring or a via contact which causes no retreat of a metal section by overpolishing by removing a section carrying little current which locally rises in a wafer face with the progress of electropolishing. In an electropolishing apparatus comprising a counter electrode (11) at a position facing a workpiece substrate (51), the counter electrode (11) consists of concentrically disposed electrodes (11a-11e). Each of the electrodes (11a-11e) has a power supply source (13) controlled independently and comprises a detector (unillustrated) for detecting a change in the current and voltage between each of the electrodes (11a-11e) and the workpiece substrate (51) and a controller (15) for controlling a power supply to the electrodes (11a-11e) on the basis of a change in the current and voltage detected by this detector.