发明名称 RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To remarkably improve melt fluidity of a resin composition with a high filler content. SOLUTION: The resin composition is obtained by compounding 100 pts.wt. of a mixture of 1-50 wt.% of a thermoplastic resin with 99-50 wt.% of a filler with 0.1-30 pts.wt. of one or more kinds selected from terphenyls having structures shown in the figure. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003277632(A) 申请公布日期 2003.10.02
申请号 JP20030003091 申请日期 2003.01.09
申请人 TORAY IND INC 发明人 NAKAMURA NAOYA;ISHIO ATSUSHI;MIYAMOTO KAZUKI
分类号 C08J3/12;B29C43/02;B29K101/12;C08K3/00;C08K5/01;C08L67/00;C08L77/00;C08L81/02;C08L101/00;(IPC1-7):C08L101/00 主分类号 C08J3/12
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