发明名称 |
Extruded heatsink and EMC enclosure |
摘要 |
An enclosed electronic component is provided by extruding first and second heatsink members having a plurality of cooling structures disposed on first surfaces thereof and an electronic component board between the first and second heatsinks, with a pair of joining members and conductive gaskets to form an electromagnetically sealed enclosure and a thermal pathway to remove heat from the electronic component.
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申请公布号 |
US2003184974(A1) |
申请公布日期 |
2003.10.02 |
申请号 |
US20020113802 |
申请日期 |
2002.03.29 |
申请人 |
ATKINSON JOHN C.;SHEARMAN SIMON E. |
发明人 |
ATKINSON JOHN C.;SHEARMAN SIMON E. |
分类号 |
H05K7/20;H05K9/00;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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