发明名称 |
INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT AND PACKAGE |
摘要 |
A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal complement traces are electrically connected to transmission or receive channels of the IC die. Use of a broadside coupled trace configuration alleviates routing congestion in an IC package and permits an IC to accommodate a greater number of channels within a given surface area than is possible under the prior art.
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申请公布号 |
US2003183919(A1) |
申请公布日期 |
2003.10.02 |
申请号 |
US20020114625 |
申请日期 |
2002.04.02 |
申请人 |
DEVNANI NURWATI S.;BARNES JAMES OLIVER;MOORE CHARLES E.;LAI BENNY W. H. |
发明人 |
DEVNANI NURWATI S.;BARNES JAMES OLIVER;MOORE CHARLES E.;LAI BENNY W. H. |
分类号 |
H01L23/498;H01L23/66;(IPC1-7):H01L23/52 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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