Memory module has two semiconductor chips stacked on top of one another with underlying chip received in recess in surface of electronic circuit board

摘要

The memory module has an electronic circuit board (10) provided with a pair of semiconductor chips (20,25) stacked one on top of the other on one side of the circuit board, each chip having an integrated circuit (21,26) on its front side, the chips secured together on their rear sides, with bonding wires (28) between the integrated circuit of the upper chip and the circuit board. The underlying chip is fitted in a recess in the surface of the circuit board provided with bonding surface contacts (15) electrically coupled to the circuit board. An Independent claim for a manufacturing method for a memory module is also included.