PRESSURE-SENSITIVE ADHESIVE FILM FOR THE SURFACE PROTECTION OF SEMICONDUCTOR WAFERS AND METHOD FOR PROTECTION OF SEMICONDUCTOR WAFERS WITH THE FILM

摘要

A pressure-sensitive adhesive film for the surface protection of semiconductor wafers which is constituted of a substrate film and a pressure-sensitive adhesive layer formed on one surface of the substrate film, wherein the pressure-sensitive adhesive layer comprises 100 parts by weight of a polymer (A) which bears functional groups reactive with a crosslinking agent and exhibits the maximum tan delta at -50 to 5°C in dynamic viscoelasticity measurements, 10 to 100 parts by weight of a polymer (B) which bears functional groups reactive with a crosslinking agent and exhibits the maximum tan delta at a temperature higher than 5°C but up to 50°C in dynamic viscoelesticity measurements, and 0.1 to 10 parts by weight (per 100 parts by weight of the total amount of the polymers (A) and (B)) of a crosslinking agent (C) having two or more crosslinking groups in the molecule and the thickness of the pressure-sensitive adhesive layer is 5 to 50mum. This pressure-sensitive adhesive film exhibits excellent close adhesion, failureproofness and stainproofness.