Copolyamide mixture for production of flexible hot melt adhesive film contains a copolyamide based on piperazine and higher dicarboxylic acid and a copolyamide with polyether sequences

摘要

Copolyamide mixtures based on a combination of 1 mol piperazine and 1 mol optionally amino-substituted 6-20C dicarboxylic acid also contain 5-90 wt% of a copolyamide with polyether sequences. Copolyamide mixtures (I) containing at least (a) 10-95 wt% of a copolyamide based on a combination of equimol. amounts of piperazine and optionally amino-substituted 6-20C dicarboxylic acid, (b) 5-90 wt% of a copolyamide with polyether sequences and optionally (c) 5-50 wt% other copolyamides and 0.5-15 wt% additives. Independent claims are also included for (1) (1) hot melt adhesive film based on (I) with a basis wt. of 15-300 g/m2 (2) (2) a method for the production of polyamide film by extrusion of (I) .