| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for testing chips that allow a more inexpensive function test under high-temperature environment. SOLUTION: A temperature elevation process is provided to make an IC chip itself heated by electric connection, to the inside of the IC chip, different from a usual condition (processing S1). A normal-directional current is impressed, for example, to a protection diode between power sources inside the IC chip, in the temperature elevation process. The inside of the IC chip is temperature-elevated by Joule heat. When the inside of the IC chip is judged to come within a prescribed temperature (processing S2), a prescribed test program is executed under the high-temperature environment (processing S3). The test program is divided plurality to execute the test program with a proper interval. Fundamentally, the inside of the IC chip is judged all the time to come within a prescribed temperature range (processings S3, S4), after one of the divided programs is executed, and the effective test program can be conducted thereby. COPYRIGHT: (C)2004,JPO
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