发明名称 PLATING APPARATUS, AND METHOD FOR CONTROLLING PLATING SOLUTION USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a plating apparatus capable of keeping the constant concentration of the additive to the plating solution through the plating work time, and a plating solution controlling method using the plating apparatus. SOLUTION: The plating apparatus 100 calibrates the plating consumption coefficient per unit treatment number for each predetermined time, and calculates the replenishment amount to the consumption of the additive associated with the plating treatment by the 'periodically calibrated plating consumption coefficient×plating treatment number'. Therefore, the consumption of the additive agrees with the replenishment of the additive. As a result, the concentration of the additive contained in the plating solution 3 is maintained at a constant value. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003277998(A) 申请公布日期 2003.10.02
申请号 JP20020085672 申请日期 2002.03.26
申请人 NEC YAMAGATA LTD 发明人 NIIMURA TOSHIKI
分类号 C25D7/06;C25D21/14;(IPC1-7):C25D21/14 主分类号 C25D7/06
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