| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for preparing a semiconductor sealing epoxy resin molding material which shows a good flow property upon packaging a semiconductor and a high package reliability after packaging, even with a high filling factor of an inorganic filler, and a semiconductor sealing epoxy resin molding material. SOLUTION: The semiconductor sealing epoxy resin molding material comprises at least an epoxy resin, a phenol resin, an inorganic filler, a curing accelerator and a coupling agent, wherein the inorganic filler content is≥90 wt.%. In the preparation process, among the inorganic fillers, inorganic fillers having an average particle size D<SB>50</SB>of≤0.5μm are subjected to a shearing force in the presence of the coupling agent to yield≤10% change of the average particle size. The inorganic fillers are pre-mixed with the rest of the components and heat kneaded. COPYRIGHT: (C)2004,JPO
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