发明名称 |
Circuit board with via through surface mount device contact |
摘要 |
According to the invention, an embodiment of a circuit board includes a substrate having a first layer and a second layer; a surface mount device pad on the first layer of the substrate; and a via, the via being formed wholly or partially through the surface mount device contact and passing through the substrate between the first layer and the second layer.
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申请公布号 |
US2003183420(A1) |
申请公布日期 |
2003.10.02 |
申请号 |
US20020108127 |
申请日期 |
2002.03.26 |
申请人 |
DISHONGH TERRANCE J.;HORINE BRYCE D. |
发明人 |
DISHONGH TERRANCE J.;HORINE BRYCE D. |
分类号 |
H05K1/11;H05K3/34;(IPC1-7):H05K1/00 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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