发明名称 Epitaxial coating applying method of semiconductor wafer in chemical vapor deposition reactor, involves exposing back surface of semiconductor wafer to ejection gas containing specific amount of hydrogen
摘要 An epitaxial coating is applied to a front surface of a semiconductor wafer (1) whose back surface is exposed to an ejection gas (6) containing 5 volume% or less of hydrogen gas, so that diffusion of doping substance from the back surface of the wafer is avoided. Independent claims are also included for the following: (1) semiconductor wafer; and (2) susceptor.
申请公布号 DE10211312(A1) 申请公布日期 2003.10.02
申请号 DE2002111312 申请日期 2002.03.14
申请人 WACKER SILTRONIC AG 发明人 AMMON, WILFRIED VON;SCHMOLKE, RUEDIGER;STORCK, PETER;SIEBERT, WOLFGANG
分类号 C23C16/44;C30B23/02;H01L21/205;H01L21/22;(IPC1-7):C30B25/02;C30B25/12;C30B29/06 主分类号 C23C16/44
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