发明名称 |
Epitaxial coating applying method of semiconductor wafer in chemical vapor deposition reactor, involves exposing back surface of semiconductor wafer to ejection gas containing specific amount of hydrogen |
摘要 |
An epitaxial coating is applied to a front surface of a semiconductor wafer (1) whose back surface is exposed to an ejection gas (6) containing 5 volume% or less of hydrogen gas, so that diffusion of doping substance from the back surface of the wafer is avoided. Independent claims are also included for the following: (1) semiconductor wafer; and (2) susceptor. |
申请公布号 |
DE10211312(A1) |
申请公布日期 |
2003.10.02 |
申请号 |
DE2002111312 |
申请日期 |
2002.03.14 |
申请人 |
WACKER SILTRONIC AG |
发明人 |
AMMON, WILFRIED VON;SCHMOLKE, RUEDIGER;STORCK, PETER;SIEBERT, WOLFGANG |
分类号 |
C23C16/44;C30B23/02;H01L21/205;H01L21/22;(IPC1-7):C30B25/02;C30B25/12;C30B29/06 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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