| 摘要 |
An electronic component and a structure of terminals thereof are proposed. The electronic component includes a plurality of terminals and a plastic main body having a plurality of terminal passageways. A pin portion of the terminal protrudes downwards out of the terminal passageway. The pin portion has a catching portion. A bottom receiving room for placing a tin ball is formed at the bottom end of the terminal passageway. After the pin portion is bent, the catching portion can catch the tin ball from below. The terminal is lengthened to facilitate electroplating. The packaging of tin ball can be accomplished without the electronic component undergoing a soldering procedure. When the electronic component is soldered to a circuit board, the pin portion can be clamped between the tin ball and a conductive copper foil of the circuit board to form a soldered structure of sandwich shape, thereby achieving good electric connection. |
