| 摘要 |
<p>PURPOSE: To make it possible to change the height of packaging from a substrate surface of the molded part of a semiconductor device flexibly by preparing lead frames having latticelike lead sections and wide breadth sections, forming molded sections, then cutting and removing parts of the ladderlike lead sections or wide breadth sections, and forming bent sections. CONSTITUTION: This manufacture comprises a process for preparing lead frames having ladderlike lead sections 1 or wide breadth sections at sites corresponding to bent sections 9. It also comprises a process of cutting and removing parts of the ladderlike lead sections or wide breadth sections to form the bent sections 9 after the formation of molded sections 7. In this way the bent sections 9 are formed by cutting and removing unnecessary parts of ladderlike lead sections 1 or wide breadth sections. Consequently, it becomes possible to manufacture different lead frames respectively according to the height of lead-frame- manufacturing metal molds, when the height of semiconductor devices from a substrate surface is required to change, and it becomes possible to deal with the issue only by the change of simple cutting metal molds.</p> |
