| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid photosetting and thermosetting resin composition giving an excellent cured film which sufficiently satisfies such properties as adhesion, heat resistance, electroless plating resistance, electric properties and PCT resistance and ensuring such working properties as excellent suitability to set to touch and developability. <P>SOLUTION: The photosetting and thermosetting resin composition comprises (A) a carboxylic photosensitive resin obtained by reacting the reaction product of an epoxy compound (a) having two or more epoxy groups in one molecule and an unsaturated group-containing monocarboxylic acid (b) with a polybasic acid anhydride (c), (B) a carboxylic photosensitive resin obtained by reacting the reaction product of a novolak type phenolic resin (d) and an alkylene oxide (e) with the unsaturated group-containing monocarboxylic acid (b) and reacting the resulting reaction product with the polybasic acid anhydride (c), (C) a photopolymerization initiator, (D) a photosensitive (meth)acrylate compound, (E) an epoxy compound and (F) a diluting solvent. Preferably the composition further comprises (G) a curing catalyst. <P>COPYRIGHT: (C)2004,JPO |
