| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus capable of adjusting the composition of the plating solution to an adequate value irrespective of the total amount of the plating solution, and checking whether or not the composition of the plating solution is adequate after adjustment. SOLUTION: This plating apparatus includes a plating solution storage tank 1 to store a large volume of plating solution, plating cups 2a-2d to perform the plating to works to be plated, a pure water feeder 21 to feed pure water to the plating solution storage tank 1, and a thinner solution feeder 31 to feed the thinner solution to the plating solution storage tank 1. A temperature sensor 15 to measure the temperature of the plating solution and an electromagnetic conductivity meter 16 to measure the conductivity of the plating solution are fitted to the plating solution storage tank 1. Solution feed branch pipes 4a-4d are provided between the plating solution storage tank 1 and the plating cups 2a-2d, and an absorbance meter 11 to measure the absorbance of the plating solution is interposed in the solution feed branch pipe 4a. COPYRIGHT: (C)2004,JPO
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