| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing with which reflow resistance and moisture proof reliability are improved while satisfying characteristics such as moldability and hardness. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin component, (B) a phenol resin curing agent, (C) a silane coupling agent and (D) an inorganic filler as essential components. The epoxy resin component (A) comprises an epoxy resin having a skeleton represented by the genera formula (1) (wherein n is an integer of 0 or≥1) and the phenol resin curing agent component (B) comprises a phenol resin having a skeleton represented by the general formula (2) (wherein n is an integer of 0 or≥1). COPYRIGHT: (C)2004,JPO
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