Electroless copper plating solution, the electroless copper plating supplementary solution, and the method of manufacturing wiring board

摘要

An object of the present invention is to provide an elecroless copper plating solution using glyoxylic acid or a salt of glyoxylic acid as the reducing agent in which the amount of Cannizzaro reaction product is small, and the mechanical property of the obtained plated film is excellent, and to provide a supplementary solution for the electroless copper plating solution, a plating method capable of stably forming a plated film using the electroless copper plating solution, and a method of manufacturing a wiring board having an excellent connecting reliability of a through hole. The present invention consist of an electroless copper plating solution including copper ions, a complexing agent of copper ion, a copper ion reducing agent containing glyoxylic acid or a salt of glyoxylic acid, a pH adjusting agent, and succinic acid; a supplementary solution for an electroless copper plating solution including a copper ion reducing agent containing glyoxylic acid or a salt of glyoxylic acid and succinic acid of 10 to 500 ppm; and an electroless copper plating method and a method of manufacturing a wiring board using the electroless copper plating solution and the supplementary solution.