| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent a crack to be caused on a semiconductor chip and a package bavel. SOLUTION: A top metal mold 100 is provided with a pair of upper and lower part mounting plates 80a, 80b opening and closing the upper and lower part molding plates, and an identification pin 4 and an upper part extrusion pin 9 being fixed to an upper part mounting plate 80a and projected up to a cavity 5a besides extruding a package after finishing injection of a molding compound into the cavity 5a. Further, a lower part metal mold 102 is provided with a first lower part extrusion pin 8 and a second lower part extrusion pin being fixed to a lower part mounting plate 80b and projected to a cavity 5b besides extruding the package bavel after finishing injection of the molding compound into a cavity 5b. Here, a lower part intermediate extrusion pin 13 is located between a first lower part extrusion pin 8 and a second lower part extrusion pin and this lower part intermediate extrusion pin 13 is fixed to the lower part mounting plate 80 and to be projected up to the cavity 5b.</p> |
