CERAMIC MULTILAYERED BOARD MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To reduce deformation and warps of a ceramic multilayer board at baking. SOLUTION: A dummy pattern 25 is screen-printed on an unwanted part outside a part (product part) of at least one of stacked green sheets 21 for forming a ceramic multilayer board, using the same conducting paste as one for printing a conductor pattern 23 on the product part. The print density of the dummy pattern 25 is pref. nearly the same as that of that pattern 23, this reducing the thickness difference between the product part 24 and unwanted part to make uniform the pressing force when the sheets 21 are laminated and compression-welded. Thus, the shrinkages of the part 25 and unwanted part are balanced in the temp. rise process during baking to suppress the deformation and warps during baking.