Surveying device for the temperature of electronic components

摘要

Surveying device for the temperature of electronic components (2), the device (1) presenting a sensor (9) which is mounted in such a way as to form a bridge between two installation bump contacts (7), which are arranged on a component side (4) of a circuit board (3), and which are positioned on either side of a terminal (6) of the electronic component (2); the sensor (9) presenting a surveying central portion (10) which directly faces the terminal (6).