发明名称 Colloidal tin-palladium solution for - chemically plating non-conductors
摘要 <p>A palladium salt is dissolved in hydrochloric acid and sufficient stannous salt added with agitation to reduce the salt to palladium metal. Sufficient stannous salt to provide a protective colloid for the palladium is separately dissolved in hydrochloric acid and the two solutions mixed. Preferred ingredients are palladium chloride, which is reduced with stannous chloride, while the protective agent is a mixture of sodium stannate and stannous chloride. The solution may be used in the production of printed circuit boards or of decorated plastics.</p>
申请公布号 DE1924194(A1) 申请公布日期 1970.11.19
申请号 DE19691924194 申请日期 1969.05.12
申请人 MACDERMID INC. 发明人 D. D'OTTAVIO,EUGENE
分类号 B01J13/00;C23C18/28 主分类号 B01J13/00
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