Passivation of organic devices

摘要

A method of passivating organic devices (24) positioned on a supporting substrate (23) including the steps of overcoating the organic device (24) with a low temperature deposited film (25) of dielectric material, and sealingly engaging (32) an inorganic layer (30) over the dielectric material (25) so as to substantially hermetically seal the organic device (24). In a typical embodiment, the dielectric layer (25) is SiO2 and the inorganic layer is a metal can (30).