发明名称 |
WATER-SOLUBLE FLUX COMPOSITION AND PROCESS FOR PRODUCING SOLDERED PART |
摘要 |
There are disclosed a water-soluble flux composition which comprises a water-soluble binder and an activating agent comprising at least one compound selected from the group consisting of a sulfonic acid compound, a sulfuric acid compound, a sulfamic acid compound, a multi-valent carboxylic acid compound and a persulfuric acid compound, and a process for producing an IC part or an electronic part which comprises the steps of coating the water-soluble flux composition on a terminal of the IC part or the electronic part and subsequently soldering the terminal.
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申请公布号 |
EP1348512(A1) |
申请公布日期 |
2003.10.01 |
申请号 |
EP20010993525 |
申请日期 |
2001.11.07 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
SAIKAWA, TETSUROU;SUMI, TAKESHI;TAKASHOU, SADAO |
分类号 |
B23K35/26;B23K35/36;(IPC1-7):B23K35/363 |
主分类号 |
B23K35/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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