| 摘要 |
A circuit with embedding components (13) is produced by placing the compoents (13) on a substrate (14) and applying sheets (15) of prepreg. The prepreg sheet (15) have apertures to accommodate the components, the number of sheets and arrangement of apertures being chosen to accomdate a varitey of component X,Y and Z dimensions. A top layer with Cu foil (16(b)) is applied. The assembly is pressed in an operation analogues to conventioanl multilayer board lamination pressing. This causes all of the prepreg resin to flow to completely embed the components without raids or damage. Electrical connections are made by drilling and plating vias. <Figure 2> |
