| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain high productivity, uniform field emission characteristic and low-voltage driving by bonding with a support substrate an emitter formed at a recess of a molded substrate separated from a master substrate having its protrusion and separating the mold substrate. SOLUTION: The entire surface on a side having a tip end convergent protrusion of a master substrate such as Ni is oxidized and covered with an insulation layer 23, on which a thin molding layer 24 composed of Ni or the like is laminated and formed. A thick support layer 25 is formed on a layer 24 by electric plating or the like, a molded substrate layer 26 composed of the layers 24 and 25 is separated from a substrate 21 having the layer 23, and a recess 27 is exposed. At this time, an air ventilation hole 28 is formed on the substrate 26 as required. Next, an insulation layer 29 is covered on the recess 27 side surface of the substrate 26 by oxidization, on which a thin conductive material layer 14 such as Au is formed, and an emitter 16 having an engaging recess 15 is achieved. A support substrate 12 such as thermo-plastic resin having a protrusion 13 with which the recess 15 comes into intimate contact is formed and separated between the layer 29 and the layer 14.</p> |
