| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a radiation sensitive resin compsn. having superior sensitivity and pattern shape, excellent in adhesion especially to a gold coated substrate and suitable for use as a material for forming a circuit board, especially for forming a gold bumper. SOLUTION: This radiation sensitive compsn. contains an alkali-soluble copolymer consisting of 10-40wt.% radical polymerizable compd. having a carboxyl group, 20-70wt.% radical polymerizable compd. having a cycloalkyl group and no carboxyl group and 5-60wt.% other radical polymerizable compds. including at least a compd. represented by the formula, a compd. having at least one ethylenic unsatd. double bond and a radiation radical polymn. initiator.</p> |
