LIQUID DROP EJECTION HEAD, ITS MANUFACTURING METHOD AND INK JET RECORDER

摘要

PROBLEM TO BE SOLVED: To solve a problem that a liquid chamber forming member employing a silicon substrate is warped when a liquid resistant thin film is formed thereon to cause failure of bonding. SOLUTION: Recesses 25 and 27 for releasing adhesive are formed on the nozzle plate bonding surface side and the diaphragm bonding surface side of a channel plate 1 and a dummy channel 26 having a shape similar to that of the liquid chamber is formed on the nozzle plate bonding surface side wherein the surface area of the nozzle plate bonding surface except the recess is set substantially equal to the surface area of the diaphragm bonding surface except the recess. COPYRIGHT: (C)2003,JPO