发明名称 BONDING METHOD FOR RESIN MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a bonding method for airtightly bonding mutual resin materials without using an adhesive agent and a mold, which method facilitates recycling, reduces weight of the whole, and realizes reduction of a cost, simplification of a process, shortening of a required time and a high positional precision. <P>SOLUTION: The bonding method comprises a process for fitting an engaging protrusion part 18 of a second resin material 16 equipped with laser transmissibility in an engaging recess part 14 of a first resin material 12 equipped with laser absorbing characteristics; a process for making a presser fixture 20 equipped with the laser transmissibility abut against a surface of the second resin material 16 by a specific pressure; a process for heating an inside of the engaging recess 14 of the first resin material 12 by a transmitted laser beam inside the presser fixture 20 and the engaging part 18 by irradiating a surface of the presser fixture 20 with laser beams L; and a process for fusion welding the fused engaging part 14 to the engaging protrusion part 18, are provided. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003276087(A) 申请公布日期 2003.09.30
申请号 JP20020081542 申请日期 2002.03.22
申请人 FINE DEVICE:KK 发明人 KODA KYOJI
分类号 B29C65/16 主分类号 B29C65/16
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