发明名称 Chip-type semiconductor light emitting device
摘要 On a rectangle-shaped insulation substrate (1) on which a pair of electrodes (2) and (3) are provided, a light emitting element chip (4) having an n-side electrode (41) and a p-side electrode (42) connected to the pair of electrodes respectively is provided. Then, the periphery of the light emitting element chip is covered with the light transmitting member (6), and a light reflection member (7) covering at least a portion of the light transmitting member is provided so that light is radiated from a portion of the light transmitting member which is not covered and exposed. A light reflection member is provided in such a manner that the portion of the light transmitting member is not covered is exposed over from a one side (A) to at least a part of the side portions (B) and (C) on both sides connected to the side portion (A). As a consequence, the directivity is widened with the result that the dark is hardly generated between the light sources which can be used as backlight even when the light sources are arranged in a large interval.
申请公布号 US6627922(B1) 申请公布日期 2003.09.30
申请号 US20000559428 申请日期 2000.04.27
申请人 ROHM CO., LTD 发明人 ISHINAGA HIROKI
分类号 H01L33/32;F21V8/00;F21V11/16;F21Y101/02;H01L21/60;H01L23/28;H01L23/29;H01L23/31;H01L33/54;H01L33/56;H01L33/60;H01L33/62;(IPC1-7):H01L29/22 主分类号 H01L33/32
代理机构 代理人
主权项
地址