Semiconductor optical sensing apparatus with reliable focusing means and casing structure

摘要

A semiconductor optical sensing apparatus is formed of a casing made of an electrically insulative material and having at least one opening at a bottom portion; a wiring device extending from an inside to an outside of the casing; a semiconductor optical sensor chip bonded to the bottom portion of the casing; and a connecting device for connecting a terminal of the sensor chip and the wiring device. A transparent filler is filled in a space inside the casing to cover the sensor chip, wherein the opening absorbs a volume change of the transparent filler caused by expansion or contraction thereof. A focusing device is connected to the casing and located at a position to focus an image on the sensor chip. The focusing device and casing are made of the same material or materials having substantially same thermal expansion coefficients. The semiconductor apparatus has a simple structure less affected by temperature variations and facilitates preventing deterioration and variation of optical characteristics, elongating life and improving reliability of the apparatus.