| 摘要 |
PROBLEM TO BE SOLVED: To provide a film having excellent thermal bondability such as low temperature sealability. SOLUTION: A polysilane is held at least at a thermally bonding site of the film. The film may be laminated on a base film to form a composite film. The polysilane may be, for example, a polysilane having at least one unit of a structural unit represented by formula (1), wherein R<SP>1</SP>to R<SP>3</SP>are the same or different, and are each an alkyl group, an aryl group, etc., and m, n and p are each a positive integer. COPYRIGHT: (C)2003,JPO
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