Substrate for semiconductor device and semiconductor device fabrication using the same

摘要

A substrate for a semiconductor device is provided, which prevents a semiconductor element or IC chip mounted thereon from being broken or damaged electrostatically in a fabrication process sequence or a semiconductor device. The substrate comprises (a) a dielectric core material with an upper surface and a lower surface; the core having a mounting area on the upper surface, a semiconductor element being mounted in the mounting area; the core having a contact area, (b) inner terminals formed on the core material; the inner terminals being used for electrical connection to the semiconductor element mounted on the core material; (c) external terminals formed on the core material; the external terminals being used for electrical connection to an external circuit provided outside the substrate; and (d) inner wiring lines formed on the core material; the inner wiring lines connecting electrically and mechanically the inner terminals with the respective external terminals; part of the inner wiring lines being located in the contact area of the core in such a way as to be able to contact an external conductor provided outside the substrate.